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Code Issues Releases Activity
1517 commits 2 branches 75 tags 6.7 MiB
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384 commits

Author SHA1 Message Date
CTCaer
41d3565353 bdk: sdmmc: deduplicate function modes get 
And parse the whole info
 2023-12-27 15:01:20 +02:00
CTCaer
b584a3f53a bdk: add several defines 2023-12-25 04:08:34 +02:00
CTCaer
7f98fb736a bdk: hwinit: reorder sdmmc1 reg disable 2023-12-25 04:07:26 +02:00
CTCaer
87c50732c0 bdk: fuse: simplify idle wait 2023-12-25 03:47:26 +02:00
CTCaer
504659a39b bdk: actmon: switch to averaged sampling 2023-12-25 03:46:05 +02:00
CTCaer
e47a819948 bdk: se: add more useful functions 
- aes cmac 128bit
- aes hashing
- option to clear updated aes iv
 2023-12-25 03:44:52 +02:00
CTCaer
913cdee8e8 bdk: sdram: rename 3rd gen t210b01 hynix ram 
Confirmed to be a Hynix H54G46CYRBX267 and not a H9HCNNNBKMMLXR-NEI
 2023-12-25 03:02:11 +02:00
CTCaer
eff55ff378 bdk: touch: rename samsung touch panel 
BH2109 is the board model and not the touch panel.
 2023-12-25 02:41:42 +02:00
CTCaer
09dfcfc57d bdk: display: deduplicate interrupt code 2023-12-25 02:40:38 +02:00
CTCaer
239c48c790 bdk: usb: hid: improve stick calibration 
Wait a bit before calibrating stick centers, in order to avoid bad values.
 2023-12-25 02:37:40 +02:00
CTCaer
ce137852b7 bdk: change some defines and comments 2023-10-12 06:59:15 +03:00
CTCaer
ce42e27f45 bdk: minerva: do not handle oc freq 
Arachne already handles it.
 2023-08-22 16:44:41 +03:00
CTCaer
d73a3fdd7c bdk: sdram: name 1a micron ram chips 
Again, as with 3rd gen samsung and hynix, that's an educated guess.
 2023-08-22 14:44:27 +03:00
CTCaer
fdf0dcc636 bdk: joycon: add info about sio imu report 2023-08-22 14:36:23 +03:00
CTCaer
f2bdc3f47c bdk: i2c: fix stack buffer overflow 2023-08-07 21:02:20 +03:00
CTCaer
1cc97ebc51 bdk: update various comments 2023-07-31 17:03:15 +03:00
CTCaer
1e28320e5a bdk: t210: add more mmio addresses 
And simplify relevant drivers that hardcoded them.
 2023-07-31 16:59:15 +03:00
CTCaer
f291a5cfa7 bdk: max17050: add reg dumping 2023-07-28 03:34:11 +03:00
CTCaer
9187fa7a8c bdk: fuse: add all t210b01 fuses 
And use B01 to distinguish the ones only on that SoC.
 2023-07-22 07:10:12 +03:00
CTCaer
b9bc35a22e bdk: dram: correct old comments 2023-07-21 18:39:46 +03:00
CTCaer
d7ad9b874b bdk: use the typedefs on jc calib 2023-06-11 13:27:48 +03:00
CTCaer
820e6d5a6e bdk: update cal0 struct 2023-06-10 23:48:45 +03:00
CTCaer
93ed4d0899 bdk: emc: add temp and feature reporting defines 2023-06-09 10:38:24 +03:00
CTCaer
01afd2de56 bdk: sdmmc: properly report comp pad status 
The reporting of the resistor being shorted or open was swapped. Fix that so it's immediately known what's the issue.
 2023-06-09 10:37:47 +03:00
CTCaer
d621d96af1 bdk: sdmmc: refactor comments 2023-06-09 10:36:29 +03:00
CTCaer
b674624ad0 bdk: timer: add instruction sleep 
usage:
`isleep(ILOOP(instructions))`

Each loop is 3 cycles, or approximately 7.35ns on 408MHz CPU clock.
 2023-06-09 10:33:11 +03:00
CTCaer
191a0533d9 bdk: clock: add more known pto ids 2023-06-09 10:29:47 +03:00
CTCaer
8502731fbd bdk: tsec: refactor some register names 2023-06-09 10:28:28 +03:00
CTCaer
18f3a1b70c bdk: max77620: reduce max DRAM VDDIO/Q 
Reduce allowed VDDIO/VDDQfor T210B01 and VDDIO for T210B01.
 2023-06-09 10:24:55 +03:00
CTCaer
c2ee6be2f5 bdk: sdram: add Samsung 8GB RAM support for T210 
And remove Copper support completely.
 2023-06-08 04:16:51 +03:00
CTCaer
73a133556d bdk: sdram: correct sku related info 
Validated so rename accordingly.
 2023-06-08 02:57:30 +03:00
CTCaer
7d3663616e bdk: sdram: name 2 of the new ram chips 
Not actually validated, but educated guess, since all previous one were correct in the end.
New Micron still unknown, can be guessed but model doesn't exist in any public list.
 2023-06-08 02:52:03 +03:00
CTCaer
e76aebabba bdk: mem: minerva: check table size in clock check 
Don't hardcode table size to 10.
 2023-06-08 02:45:34 +03:00
CTCaer
bc0eea11f3 bdk: joycon: add calibration struct 2023-06-08 02:44:35 +03:00
CTCaer
795b4ad26e bdk: sdmmc: increase bw priority to SDMMC1 for L4T 2023-04-06 17:30:01 +03:00
CTCaer
bb10b8aea3 bdk: sdmmc: small refactor 2023-04-06 10:19:53 +03:00
CTCaer
811fa4c88b bdk: sdmmc: add SD registers debug printing 
Can be enabled with `SDMMC_DEBUG_PRINT_SD_REGS`
 2023-04-06 10:13:35 +03:00
CTCaer
8528e6a08a bdk: util: do not edit rtc alarm in power function 2023-03-31 09:12:58 +03:00
CTCaer
27ae312227 bdk: minor naming edits 2023-03-31 09:11:55 +03:00
CTCaer
50811aacfa bdk: touch: reorder power on 
So touch IC reset can be properly done on a fast power cycle.
 2023-03-31 09:08:20 +03:00
CTCaer
f4bf48e76a bdk: sdmmc: add driver type set support 2023-03-31 09:04:10 +03:00
CTCaer
d258c82d52 bdk: sdmmc: add UHS DDR200 support 
The bdk flag BDK_SDMMC_UHS_DDR200_SUPPORT can be used to enable it.

SD Card DDR200 (DDR208) support

Proper procedure:
1. Check that Vendor Specific Command System is supported.
   Used as Enable DDR200 Bus.
2. Enable DDR200 bus mode via setting 14 to Group 2 via CMD6.
   Access Mode group is left to default 0 (SDR12).
3. Setup clock to 200 or 208 MHz.
4. Set host to DDR bus mode that supports such high clocks.
   Some hosts have special mode, others use DDR50 and others HS400.
5. Execute Tuning.

The true validation that this value in Group 2 activates it, is that DDR50 bus
and clocks/timings work fully after that point.

On Tegra X1, that can be done with DDR50 host mode.
Tuning though can't be done automatically on any DDR mode.
So it needs to be done manually and selected tap will be applied from the
biggest sampling window.

Finally, all that simply works, because the marketing materials for DDR200 are
basically overstatements to sell the feature. DDR200 is simply SDR104 in DDR mode,
so sampling on rising and falling edge and with variable output data window.
It can be supported by any host that is fast enough to support DDR at 200/208MHz
and can do hw/sw tuning for finding the proper sampling window in that mode.

Using a SDMMC controller on DDR200 mode at 400MHz, has latency allowance implications. The MC/EMC must be clocked enough to be able to serve the requests in time (512B in 1.28 ns).
 2023-03-31 08:54:13 +03:00
CTCaer
7f32c6d211 bdk: sd: better removal detection handling 2023-03-31 08:31:20 +03:00
CTCaer
2f7e841b50 bdk: sdmmc: move sdr12 setup for better readability 2023-03-31 08:29:20 +03:00
CTCaer
29e32f09fb bdk: sdmmc: properly identify sdmmc1 clk config 
Remove schmitt trigger config from clock pin on sdmmc1 for identifying previous pinmuxing state.
 2023-03-31 08:27:48 +03:00
CTCaer
b123571c56 bdk: sdmmc: only allow power raise if SDR50 and up 
As per spec.
 2023-03-31 08:26:19 +03:00
CTCaer
b7164a629f bdk: sdmmc: allow max power limit to be set 
Even if it defaults to 1.44W.
Some cards' firmware maybe be bugged.

The 3.3V regulator on all SKUs allow more than 800mA current anyway.
 2023-03-31 08:24:52 +03:00
CTCaer
25be98b7e3 bdk: sdmmc: add UHS DDR50 support 
But disable it by default in the auto selection.
 2023-03-31 08:23:10 +03:00
CTCaer
76a5facbc3 bdk: clock: rename clock_t to clk_rst_t 
To avoid redefines when standard math header is used.
 2023-03-31 08:18:45 +03:00
CTCaer
502fc1ed50 bdk: sdmmc: rename ddr100 to the actual HS100 name 2023-03-31 08:15:40 +03:00